DFX
CommAgility products are designed from the outset to provide carrier grade service. To accomplish this consideration is given to manufacturability, testability, signal integrity, operating temperature, the environment and not least - performance.

MANUFACTURABILITY
The products, whilst complex and densely populated use 'standard' PCB and manufacturing techniques to IPC guidelines. This results in a quality, durable and high yielding product.

TEST
The complex products are designed so that the test coverage is excellent. A high quality fully-tested product can be shipped to the customer whilst minimising costs (& therefore price).

SIGNAL INTEGRITY
Signal Integrity simulation is conducted using the same tool vendor's integrated toolset as the PCB designer's suite. Constraints are passed seemlessly from schematics to PCB and back again to ensure that the design is implemented as intended.

THERMAL
With NEBS and ETSI requirements in mind, thermal simulation is conducted before the first chips are placed onto the PCB design. This process ensures that the carrier grade product will operate reliably in harsh target environments.

MECHANICAL
Heatsinks and other mechanical components are engineered using CAD tools to eliminate hotspots and increase reliability.

ENVIRONMENT
The products are RoHS compliant.