AdvancedMC board includes FPGA, two TMS320C6678 DSPs and fast, flexible I/O

Loughborough, UK, 7th August 2013 - CommAgility today announced the AMC-V7-2C6678, a high performance Advanced Mezzanine Card (AMC) module based on the latest Xilinx Virtex®-7 FPGA and two TI TMS320C6678 multicore DSPs. The module also provides fast, flexible I/O including Serial RapidIO (SRIO), Gigabit Ethernet and PCI Express. It is ideal for a range of high performance DSP/FPGA processing applications including telecoms and image processing.

The AMC-V7-2C6678 includes a high density XC7VX415T-2 Virtex-7 FPGA as standard, with other FPGA options available on request. Virtex-7 FPGAs provide high DSP performance and I/O bandwidth, with best-in-class total power consumption that is 50% less than the previous generation."

The Virtex-7 family of FPGAs provide excellent performance with their high density, low power 28nm technology, enabling them to handle complex system requirements," said Giles Peckham, EMEA Marketing Director at Xilinx. "By including a Virtex-7 FPGA in their latest AdvancedMC module, together with fast I/O and powerful DSPs, CommAgility has created a board that can meet tough processing challenges."

The new AMC also provides two TMS320C6678 fixed- and floating-point octal core DSPs from Texas Instruments (TI), based on TI's KeyStone multicore architecture. The DSPs run at 1.25 GHz, giving a combined performance of 320 GFLOPS and 640 GMACS. With 16 DSP cores and shared memory, the new module delivers high DSP performance. Two fast 5Gbaud PCI Express links are provided to connect the FPGA with each of the two DSPs.

The AMC-V7-2C6678 provides flexible connectivity to the backplane and front panel, delivering high speed I/O to support the FPGA and two DSPs. The Gigabit Ethernet interface uses on-board switches for maximum flexibility and access to all DSPs on the card.

An IDT CPS-1848 Gen2 SRIO switch supports Serial RapidIO at up to 20Gbps per port. As standard, the board includes a single front panel SFP+ optical interface that links directly to the FPGA, plus a single mini-SAS connector linked to the SRIO switch. Should applications require timing and synchronisation, this is achieved via the front panel or backplane clock I/O, enabling the module to sync easily to other equipment.

2GB of high bandwidth DDR3-1333 SDRAM is provided as standard for each DSP, with an additional 512MB x 16 of DDR3-800 SDRAM and 1GB x 32 of DDR3-1250 SDRAM provided for the FPGA. 256MB of flash memory is also included, which can be used to store multiple FPGA images and software. Separate glue logic is provided for board configuration and management. This allows control, FPGA configuration and flash reprogramming over the SRIO or SPI interfaces.

Available software includes a full MicroBlaze board support library for the FPGA, and full board support libraries for the DSPs. Additional debug support is provided via on-board serial port connectors, plus RS-232 and JTAG debug via the CommAgility AMC-BB Debug Breakout Board.

The new module is a compact full-size, single width PICMG AMC.0 R2.0 AMC, and is suitable for use in both ATCA carriers and MicroTCA chassis. It can also operate standalone, with suitable power and cooling. A range of build options is available, and further customisation is possible in volume, to enable the best technical and commercial fit to a customer application to be achieved.

The AMC-V7-2C6678 is available now. For pricing, please contact CommAgility.

About CommAgility:
CommAgility is a leading manufacturer of signal processing AMC modules for wireless and other signal processing applications, combining flexible interfaces including analogue RF, the latest Texas Instruments DSPs and Xilinx FPGAs, and high bandwidth on and off-card communications using Serial RapidIO and Ethernet. Customers around the world use CommAgility products to develop a wide range of high performance applications, and recent designs include test equipment, trial systems and base stations for a wide range of wireless standards especially WiMAX, LTE and LTE Advanced.

Contact: This email address is being protected from spambots. You need JavaScript enabled to view it.
Tel: +44 1509 228866

Press contact:
Nick Daines
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Tel: +44 (0)115 8412109
Mobile: +44 (0)7958 534731